Ultra-Short Pulse Laser Drilling and Etching System for LTCC/HTCC - Delphi Laser 
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Ultra-Short Pulse Laser Drilling and Etching System for LTCC/HTCC








Technical Specifications for LTCC:

Processable materials: low temperature co-fired ceramic (LTCC)

Processing aperture: 20μm

Processing precision: ±5μm

Working area: 400mmX400mm

Processing speed: 1000-2000 holes per second


Technical Specification for Laser Exposure:

Working area: 800mmX800mm

Minimum line width: 1μm

Positional accuracy: ±0.5μm

Surface roughness: 0.1μm





Sample Figure