This system is equipped with an ultra-fast picosecond pulse laser and a high-speed galvanometer scanner for performing machining operations on a wide range of materials.
◆ Excellent laser beam quality to ensure long-run stability.
◆ Minimal heat-affected zone.
◆ Higher single-pulse energy power and processing precision for the capability to process all kinds of solid materials.
◆ Non-contact machining; improved processing quality and yields.
◆ Excellent processing flexibility; able to cut any shape.
◆ Software can be customized to meet the demands of each customer’s applications.
◆ Integrated system design features an anti-seismic marble platform to improve the machine’s operating stability.
◆ Specialized dust collection system maintains the cleanliness of the processing environment and increases the duration of the equipment’s life cycle.
◆ Specialized vacuum adsorption fixture improves processing stability and efficiency.
◆ Working area: 250mm×250mm (X-Y-axes)
◆ Power: 60/40/20W@1064nm (customizable)
◆ Wavelength: 1064/532/355nm
◆ Pulse width: <13ps
◆ Focal spot diameter: 10-25μm (adjustable)
◆ Maximum operating speed: 800mm/s（X-Y-axes）; 20mm/s（Z-axis）
◆ Processable materials: glass, ceramics, resins, stone, sapphire, silicon, copper, stainless steel, various alloys, and thin filmmaterials.
◆ Applicable industries: scientific research, semiconductor, biomedical, etc.
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