Picosecond Laser Micromachining System (DPS/DPD) - Delphi Laser 
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Picosecond Laser Micromachining System (DPS/DPD)

This system is equipped with an ultra-fast picosecond pulse laser and a high-speed galvanometer scanner for performing machining operations on a wide range of materials.

Excellent laser beam quality to ensure long-run stability.

◆ Minimal heat-affected zone.

◆ Higher single-pulse energy power and processing precision for the capability to process all kinds of solid materials.

◆ Non-contact machining; improved processing quality and yields.

◆ Excellent processing flexibility; able to cut any shape.

◆ Software can be customized to meet the demands of each customer’s applications.

◆ Integrated system design features an anti-seismic marble platform to improve the machine’s operating stability.

◆ Specialized dust collection system maintains the cleanliness of the processing environment and increases the duration of the equipment’s life cycle.

◆ Specialized vacuum adsorption fixture improves processing stability and efficiency.

◆ Working area: 250mm×250mm (X-Y-axes)

◆ Power: 60/40/20W@1064nm (customizable)

◆ Wavelength: 1064/532/355nm

◆ Pulse width: <13ps

◆ Focal spot diameter: 10-25μm (adjustable)

◆ Maximum operating speed: 800mm/s(X-Y-axes); 20mm/s(Z-axis)

Applicable workpieces:

    ◆ Processable materials: glass, ceramics, resins, stone, sapphire, silicon, copper, stainless steel, various alloys, and thin filmmaterials.

    ◆ Applicable industries: scientific research, semiconductor, biomedical, etc.

Sample Figure: