This high-end laser micromachining system features high-efficiency components and is intelligently integrated to deliver precise material drilling, cutting, and surface etching results.
◆ Excellent laser beam quality to ensure long-run stability.
◆ High laser peak power; able to process all kinds of solid materials.
◆ Excellent processing flexibility; able to cut any shape.
◆ Narrow processing line width and good edge quality; minimal heat-affected zone.
◆ Non-contact machining; improved processing quality and yields.
◆ Working area: 250*250mm (X-Y-axes)
◆ Wavelength: 1064/532/355nm
◆ Frequency: 10-1000Hz
◆ Pulse width: <25ns
◆ Focal spot diameter: 10-25μm (adjustable)
◆ Scanning speed: ≥3000mm/s
◆ Maximum operating speed: 200mm/s（X-Y-axes; 25mm/s（Z-axis）
◆ Positional accuracy: ±3μm
◆ Repeatability: ±2μm
ceramics, glass, quartz, indium phosphide, alloys,tungsten copper, polymers,Rogers boards, polyimide.
TSV 100μm micro-holes Side wall hole Hole drilling in metals
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