Laser System for Wafer Grooving(AlGaInP) - Delphi Laser 
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Laser System for Wafer Grooving(AlGaInP)

Model: AS-5360

◆ Fast scribing speeds; high yield rates; high production capacity

◆ Produces high-quality results with no residue or melt-back

◆ Fully-automatic processing; integrated coating application, wafer cutting, and cleaning functions

◆ Laser type: DPSS 355nm ultraviolet laser

◆ Laser power: 5W

◆ Cooling method: Closed-loop water cooling

◆ X-axis cutting speed: 600mm/s

◆ Applicable wafer sizes: 2, 4, or 6 inches

◆ Cutting line width: <15μm@ 40μm grooving depth

◆ Dicing street width: 30μm

◆ Processing method: Automatic single-axis processing via front-side or backside cutting

◆ Imaging system: Coaxial CCD and paraxial CCD

◆ Scribing depth: Can vary or maintain a constant scribing

◆ Lighting system: High-power LED light with adjustable brightness

Applicable workpieces:

   ◆ Applicable materials: Silicon, gallium arsenide

   ◆ Process workflow: Protective coating application à Laser cutting à Wafer cleaning

Sample Figure: