◆ Fast cutting speeds;
◆ Pause-less cutting process;
◆ Stable performance;
◆ No consumables;
◆ High production capacity and yield rates;
◆ Greatly reduces operating costs.
◆ Laser type: DPSS 1064nm picosecond laser
◆ Laser power: ≥1W
◆ Cooling method: Closed-loop water cooling
◆ X-axis: 360mm travel length, 0.1μm resolution
◆ Y-axis: 360mm travel length, 0.1μm resolution
◆ Z-axis: 15mm travel length, 1μm resolution
◆ θ-axis: ±60° travel angle, 0.0001° resolution
◆ Scribing depth: 10-25μm
◆ Throughput: 24pcs/hr@10*23mil (2-inch wafers)
◆ Applicable wafer sizes: 2 or 4 inches (can be outfitted to process 6-inch wafers)
◆ Cutting line width: <5μm
◆ Dicing street width: ≥18μm
◆ Wafer die size: >4mil
◆ Processing method: Automatic single-axis processing via backside cutting.
◆ Imaging system: Coaxial CCD and paraxial CCD.
◆ Lighting system: High-power LED light with adjustable brightness.
◆ Operating system and software: Windows XP with all-Chinese control software.
◆ Real-time laser power monitoring during dicing.
◆ Real-time image correction.
◆ Imaging system automatically tracks distance between dicing line and edge of dicing street.
◆ Real-time focus control.
◆ Optional dual spot processing capability.
Coated and uncoated DBR wafers (without metal layers)
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